METAL SOLUTIONS

EOS Copper Cu

Material Data Sheet | Powder Product No. 9030-0002

EOS Copper Cu

High purity copper to reach good electrical and thermal conductivity. Suitable for a wide variety of applications.

MAIN CHARACTERISTICS

  • High purity copper
  • Good electrical and heat conductivity
  • Process developed to achieve best possible conductivity using the EOS M 290

TYPICAL APPLICATIONS

  • Heat exchangers 
  • Electronics
  • Variety of industry applications requiring good conductivity

The EOS Quality Triangle

Material Data Sheet | Powder Product No. 9030-0002
EOS uses an approach that is unique in the AM industry, taking each of the three central technical elements of the production process into account: the system, the material and the process. The data resulting from each combination is assigned a Technology Readiness Level (TRL) which makes the expected performance and production capability of the solution transparent.

EOS incorporates these TRLs into the following two categories:
 
  • Premium products (TRL 7-9): offer highly validated data, proven capability and reproducible part properties. 
  • Core products (TRL 3 and 5): enable early customer access to newest technology still under development and are therefore less mature with less data.

All of the data stated in this material data sheet is produced according to EOS Quality Management System and international standards
EOS 3D Printing Solutions Quality Triangle

POWDER PROPERTIES

Powder Chemical Composition (wt.-%)

Element Min. Max.
Cu Balance
O - 0.35
- - 0.5

Powder Particle Size

Generic Particle Size Distribution 15 - 45 µm

HEAT TREATMENT

Description

Copper can be heat treated to reach different mechanical properties and conductivity values

Steps

Hold 1 h at ~ 1000 °C in argon atmosphere, slow cooling with argon

Process Data Sheet

EOS Copper Cu for EOS M 290 | 20 µm

EOS M 290 - 20 µm - TRL 3

System Setup EOS M 290
EOS Material set Cu_020_CoreM291_100
Powder Product No. 9030-0002
Software Requirements

EOSPRINT 2.6 or higher
Recoater Blade HSS (High Speed Steel)
Nozzle EOS Grid Nozzle
Inert gas Argon
Sieve 63 µm
Additional Information
Layer Thickness 20 µm
Volume Rate 1.7 mm³/s

Chemical and Physical Properties of Parts

Microstructure of the Produced Parts

Defects Thickness Result Number of Samples
Average Defect Percentage 20 µm < 5 %* % -

* depending on job load and part geometry

 

Copper and its alloys have high conductivity; hence high power is required for processing. The achieved density, which influences the mechanical properties, is typical for a 400 W laser. Please refer to the application notes for EOS Copper products for further information.

Mechanical Properties

Mechanical Properties As Manufactured

EN ISO 6892-1 Room Temperature | 20 µm Yield Strength [MPa] Tensile Strength [MPa] Elongation at Break A [%] Reduction of Area Z [%] Modulus of elasticity [GPa] Number of Samples
Vertical 180 200 5 - - -
Horizontal 180 200 5 - - -

Mechanical Properties Heat Treated

EN ISO 6892-1 Room Temperature | 20 µm Yield Strength [MPa] Tensile Strength [MPa] Elongation at Break A [%] Reduction of Area Z [%] Modulus of elasticity [GPa] Number of Samples
Vertical 140 190 20 - - -
Horizontal 140 190 20 - - -

Copper can be heat treated to reach different mechanical properties and conductivity values.
Properties in the table have been achieved with following heat-treatment: 

Hold 1 h at ~ 1,000 °C in argon atmosphere, slow cooling with argon 

Surface Roughness

Surface Roughness datasheet.headline.surface_roughness.from datasheet.headline.surface_roughness.to
datasheet.surface_roughness.sa - -
datasheet.surface_roughness.ra - -

Electrical Conductivity

ASTM E1004-17 Orientation Typical Electrical Conductivity [%IACS]
As Manufactured | 20 µm | Vertical 80
As Manufactured | 20 µm | Horizontal 80
ASTM E1004-17 Orientation Typical Electrical Conductivity [%IACS]
Heat Treated | 20 µm | Vertical 90
Heat Treated | 20 µm | Horizontal 90
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