METAL SOLUTIONS
EOS Copper Cu
Material Data Sheet
EOS Copper Cu
High purity copper to reach good electrical and thermal conductivity. Suitable for a wide variety of applications.
- High purity copper
- Good electrical and heat conductivity
- Process developed to achieve best possible conductivity using the EOS M 290
- Heat exchangers
- Electronics
- Variety of industry applications requiring good conductivity
The EOS Quality Triangle
EOS uses an approach that is unique in the AM industry, taking each of the three central technical elements of the production process into account: the system, the material and the process. The data resulting from each combination is assigned a Technology Readiness Level (TRL) which makes the expected performance and production capability of the solution transparent.
EOS incorporates these TRLs into the following two categories:
All of the data stated in this material data sheet is produced according to EOS Quality Management System and international standards
EOS incorporates these TRLs into the following two categories:
- Premium products (TRL 7-9): offer highly validated data, proven capability and reproducible part properties.
- Core products (TRL 3 and 5): enable early customer access to newest technology still under development and are therefore less mature with less data.
All of the data stated in this material data sheet is produced according to EOS Quality Management System and international standards
POWDER PROPERTIES
Powder Chemical Composition (wt.-%)
| Element | Min. | Max. |
|---|---|---|
| Cu | Balance | |
| O | - | 0.35 |
| Other Elements Total | - | 0.5 |
Powder Particle Size
| GENERIC PARTICLE SIZE DISTRIBUTION | 15 - 45 μm | |
|---|---|---|
HEAT TREATMENT
Copper can be heat treated to reach different mechanical properties and conductivity values
Hold 1 h at ~ 1000 °C in argon atmosphere, slow cooling with argon
Process Data Sheet
EOS Copper Cu for EOS M 290 | 20 µm
EOS M 290 - 20 µm - TRL 3
| System Setup | EOS M 290 |
|---|---|
| EOS Material set | Cu_020_CoreM291_100 |
| Software Requirements |
EOSPRINT 2.6 or higher |
| Recoater Blade | HSS (High Speed Steel) |
| Nozzle | EOS Grid Nozzle |
| Inert gas | Argon |
| Sieve | 63 µm |
| Additional Information | |
|---|---|
| Layer Thickness | 20 µm |
| Volume Rate | 1.7 mm³/s |
Chemical and Physical Properties of Parts
Microstructure of the Produced Parts
| Defects | Thickness | Result | Number of Samples |
|---|---|---|---|
| Average Defect Percentage | 20 µm | < 5 %* % | - |
Mechanical Properties
Mechanical Properties As Manufactured
| EN ISO 6892-1 Room Temperature | Yield Strength [MPa] | Tensile Strength [MPa] | Elongation at Break A [%] | Reduction of Area Z [%] | Number of Samples | |
|---|---|---|---|---|---|---|
| Vertical | 180 | 200 | 5 | - | - | - |
| Horizontal | 180 | 200 | 5 | - | - | - |
Mechanical Properties Heat Treated
| EN ISO 6892-1 Room Temperature | Yield Strength [MPa] | Tensile Strength [MPa] | Elongation at Break A [%] | Reduction of Area Z [%] | Number of Samples | |
|---|---|---|---|---|---|---|
| Vertical | 140 | 190 | 20 | - | - | - |
| Horizontal | 140 | 190 | 20 | - | - | - |
Copper can be heat treated to reach different mechanical properties and conductivity values.
Properties in the table have been achieved with following heat-treatment:
Hold 1 h at ~ 1,000 °C in argon atmosphere, slow cooling with argon
Electrical Conductivity
| ASTM E1004-17 | Orientation | Typical Electrical Conductivity [%IACS] |
|---|---|---|
| As Manufactured | 20 µm | | Vertical | 80 |
| As Manufactured | 20 µm | | Horizontal | 80 |
| ASTM E1004-17 | Orientation | Typical Electrical Conductivity [%IACS] |
|---|---|---|
| Heat Treated | 20 µm | | Vertical | 90 |
| Heat Treated | 20 µm | | Horizontal | 90 |