EOS Copper CuCP
Material Data Sheet
EOS Copper CuCP
Commercially pure copper designed to reach excellent conductivity properties. Suitable for a wide variety of applications.
- Commercially pure copper (> 99.95 % purity)
- Excellent electrical and heat conductivity
- Electrical motors
- Inductors
- Variety of industry applications requiring excellent conductivity properties
The EOS Quality Triangle
EOS incorporates these TRLs into the following two categories:
- Premium products (TRL 7-9): offer highly validated data, proven capability and reproducible part properties.
- Core products (TRL 3 and 5): enable early customer access to newest technology still under development and are therefore less mature with less data.
All of the data stated in this material data sheet is produced according to EOS Quality Management System and international standards
POWDER PROPERTIES
Powder Chemical Composition (wt.-%)
| Element | Min. | Max. |
|---|---|---|
| Cu | 99.95 | - |
| O | 0.0 | 0.04 |
Powder Particle Size
| GENERIC PARTICLE SIZE DISTRIBUTION | 15 - 53 μm | |
|---|---|---|
SEM micrograph of EOS Copper CuCp powder
HEAT TREATMENT
Heat treatment of parts built with EOS Copper CuCP is only optional, but can ensure maximum conductivity and uniform structure.
Hold 1 h at ~1000 °C, slow cooling. Treatment done in heavy argon flow or in vacuum furnace
EOS Copper CuCP for EOS M 300-4 1kW | 40 µm
EOS M 300-4 1kW - 40 µm - TRL 3
Process Information Metal
The EOS Copper CuCP process contains two exposure sets. The default exposure set with Technology Readiness Level 5 for general use and bulkier parts and an application specific exposure set targeted for inductors.
| System Setup | EOS M 300-4 1kW |
|---|---|
| EOS Material set | CuCP_040_CoreM314 |
| Required Software Plan | EOS BUILD |
| Software Requirements |
EOSPRINT 2.15 or newer EOSYSTEM 2.19 or newer |
| Recoater Blade | HSS (High Speed Steel) |
| Inert gas | Argon |
| Sieve | 63 µm |
| Additional Information | |
|---|---|
| Layer Thickness | 40 µm |
| Volume Rate | Default: 5.4 mm³/s; Inductor: 4.6 mm³/s |
| Min. Wall Thickness | Default: 0.7 mm; Inductor: 0.6 mm |
Chemical and Physical Properties of Parts
Chemical composition of printed parts matches the chemistry of EOS Copper CuCP powder, but can vary due to different oxygen levels in the process, depending on the machine and use level of the powder.
Microstructure of the Produced Parts
| Defects | Thickness | Result | Number of Samples |
|---|---|---|---|
| Average Defect Percentage | 40 µm | 0.25 % | - |
| Average Defect Percentage | 40 µm | 0.4 % | - |
| Density | Thickness | Result | Number of Samples |
|---|---|---|---|
Mechanical Properties
Mechanical Properties As Manufactured
| EN ISO 6892-1 Room Temperature | Yield Strength [MPa] | Tensile Strength [MPa] | Elongation at Break A [%] | Reduction of Area Z [%] | Number of Samples | |
|---|---|---|---|---|---|---|
| Vertical | 165 | 230 | 45 | - | - | - |
| Horizontal | 155 | 230 | 40 | - | - | - |
Modulus of elasticity testing according to EN ISO 6892-1 Method A, Range 1 (0.00007 1/s).
Mechanical Properties As Manufactured
| EN ISO 6892-1 Room Temperature | Yield Strength [MPa] | Tensile Strength [MPa] | Elongation at Break A [%] | Reduction of Area Z [%] | Number of Samples | |
|---|---|---|---|---|---|---|
| Vertical | 155 | 220 | 35 | - | - | - |
| Horizontal | 155 | 230 | 45 | - | - | - |
Heat treatment of parts built with EOS Copper CuCP is only optional, but can ensure maximum conductivity and uniform structure.
Hold 1 h at ~1 000 °C, slow cooling. Treatment done in heavy argon flow or in vacuum furnace.
Modulus of elasticity testing according to EN ISO 6892-1 Method A, Range 1 (0.00007 1/s).
Surface Roughness
Electrical Conductivity
| Orientation | Typical Electrical Conductivity [%IACS] | |
|---|---|---|
| As Manufactured | 40 µm | Default | Vertical | 99.6 |
| As Manufactured | 40 µm | Default | Horizontal | 99.6 |
| Orientation | Typical Electrical Conductivity [%IACS] | |
|---|---|---|
| As Manufactured | 40 µm | Application optimised - Inductors | Vertical | 99.7 |
| As Manufactured | 40 µm | Application optimised - Inductors | Horizontal | 99.7 |
EOS Copper CuCP for EOS M 290 1kW & AMCM M290 1kW | 40 µm
EOS M 290 1kW - 40 µm - TRL 5
Process Information Metal
The EOS Copper CuCP process contains two exposure sets. One exposure set with Technology Readiness Level 5 for general use and bulkier parts and an application specific exposure set targeted for inductors.
| System Setup | EOS M 290 1kW |
|---|---|
| EOS Material set | CuCP_Core040_M294; CuCP_040_M291_1kW |
| Software Requirements |
EOSPRINT 2.15 or newer EOSYSTEM 2.19 or newer |
| Recoater Blade | HSS (High Speed Steel), Carbon Fiber Brush, Silicone |
| Nozzle | EOS Grid Nozzle |
| Inert gas | Argon |
| Sieve | 63 µm |
| Additional Information | |
|---|---|
| Layer Thickness | 40 µm |
| Volume Rate | 5.4 mm³/s |
| Min. Wall Thickness | 0.7 mm |
Chemical and Physical Properties of Parts
Chemical composition of printed parts matches the chemistry of EOS Copper CuCP powder, but can vary due to different oxygen levels in the process, depending on the machine and use level of the powder.
Microstructure of the Produced Parts
| Defects | Thickness | Result | Number of Samples |
|---|---|---|---|
| Average Defect Percentage | 40 µm | 0.4 % | - |
| Density | Thickness | Result | Number of Samples |
|---|---|---|---|
Mechanical Properties As Manufactured
| EN ISO 6892-1 Room Temperature | Yield Strength [MPa] | Tensile Strength [MPa] | Elongation at Break A [%] | Reduction of Area Z [%] | Number of Samples | |
|---|---|---|---|---|---|---|
| Vertical | 160 | 225 | 48 | - | 150 | - |
| Horizontal | 155 | 230 | 45 | - | 150 | - |
Heat treatment of parts built with EOS Copper CuCP is only optional, but can ensure maximum conductivity and uniform structure.
Hold 1 h at ~1 000 °C, slow cooling. Treatment done in heavy argon flow or in vacuum furnace.
Modulus of elasticity testing according to EN ISO 6892-1 Method A, Range 1 (0.00007 1/s).
Surface Roughness
Effects of Powder Reuse
The effects of powder reuse are investigated by running multiple test jobs, until the powder amount was consumed. After every test job, electrical conductivity and porosity were examined, to link powder aging effects to solid part quality.
Electrical conductivity and average defect percentage of parts built with EOS Copper CuCP is depended on the use level of powder and position on the building platform. The electrical conductivity can be maximized by heat treating the final parts.
Left graph: Electrical conductivity IACS% over multiple powder re-uses. The samples were as manufactured and taken from middle of building platform.
There were no measurements after the 4th and 9th reuse. Results may vary over the building platform. Testing according ASTM E1004-17, Eddy Current.
Right graph: Average defect percentage % over multiple powder reuses. The samples were as manufactured and taken from middle of building platform.
There were no measurements after the 4th and 9th reuse. Results may vary over the building platform.