METAL SOLUTIONS

EOS Nickel NiCP

Material Data Sheet

EOS Nickel NiCP

Commercially Pure Nickel

Ideal for semiconductor and chemical applications requiring Nickel purity, corrosion resistance and ductility. This material provides a tensile strength of 400 MPa and 49% elongation, making it an ideal candidate for applications like gas injectors and corrosion resistant components within semiconductor capital equipment.

MAIN CHARACTERISTICS

  • High purity
  • High ductility
  • Good corrosion resistance

TYPICAL APPLICATIONS

  • Semiconductor manufacturing parts
  • Chemical industry parts

The EOS Quality Triangle

EOS uses an approach that is unique in the AM industry, taking each of the three central technical elements of the production process into account: the system, the material and the process. The data resulting from each combination is assigned a Technology Readiness Level (TRL) which makes the expected performance and production capability of the solution transparent.

EOS incorporates these TRLs into the following two categories:
 
  • Premium products (TRL 7-9): offer highly validated data, proven capability and reproducible part properties. 
  • Core products (TRL 3 and 5): enable early customer access to newest technology still under development and are therefore less mature with less data.

All of the data stated in this material data sheet is produced according to EOS Quality Management System and international standards
EOS 3D Printing Solutions Quality Triangle

POWDER PROPERTIES

Powder and built part compositions meet the chemical composition requirements of ASTM B162 and SAE AMS5553.

Powder Chemical Composition (wt.-%)

Element Min. Max.
Ni 99 -
C - 0.02
Mn - 0.35
Si - 0.35
S - 0.01
Fe - 0.4
Cu - 0.25

Powder Particle Size

Generic Particle Size Distribution 15 - 63 µm

SEM micrograph of EOS Nickel NiCP powder

HEAT TREATMENT

Description

Heat treatment procedure

Steps

Step 1:

Stress relieve: Hold temperature 580 °C, hold time minimum 2 h when thoroughly heated. Air cooling or equivalent cooling rate.

Process Data Sheet

EOS Nickel NiCP for EOS M 290 | 80 µm

EOS M 290 - 80 µm - TRL 3

System Setup EOS M 290
EOS Material set NiCP_080_CoreM291_1xx
Software Requirements

EOSPRINT 2.15 or newer

EOSYSTEM 2.19 or newer
Recoater Blade Ceramic
Nozzle EOS Grid Nozzle
Inert gas Argon
Sieve 63 µm
Additional Information
Layer Thickness 80 µm
Volume Rate 8.0 mm³/s

Chemical and Physical Properties of Parts

Micrograph of polished surface

Microstructure of the Produced Parts

Defects Thickness Result Number of Samples
Average Defect Percentage 80 µm <0.1 % -
Density EN ISO 3369 Thickness Result Number of Samples
Average Density 80 µm ≥8.85 g/cm³ -

Mechanical Properties

Mechanical Properties Heat Treated

EN ISO 6892-1 Room Temperature | 80 µm Yield Strength [MPa] Tensile Strength [MPa] Elongation at Break A [%] Reduction of Area Z [%] Modulus of elasticity [GPa] Number of Samples
Vertical 210 370 46 67 - -
Horizontal 220 400 49 81 - -

Stress relieve:
Hold temperature 580 °C, hold time minimum 2 h when thoroughly heated. Air cooling or equivalent cooling rate.

Mechanical Properties As Manufactured

Room Temperature | Yield Strength [MPa] Tensile Strength [MPa] Elongation at Break A [%] Reduction of Area Z [%] Modulus of elasticity [GPa] Number of Samples
Vertical 310 400 47 79 - -
Horizontal 350 430 39 78 - -

Surface Roughness

Coefficient of Thermal Expansion

Temperature
12.6*10-6/K 25 – 100 ºC
13.9*10-6/K 25 – 200 ºC
14.5*10-6/K 25 – 300 ºC
Heat Treated Temperature
15*10-6/K 25 – 400 ºC
Process Data Sheet

EOS Nickel NiCP for EOS M 400-4 | 80 µm

EOS M 400-4 - 80 µm - TRL 3

System Setup EOS M 400-4
EOS Material set NiCP_080_CoreM404_1xx
Software Requirements

EOSPRINT 2.15 or newer

EOSYSTEM 2.19 or newer
Recoater Blade Ceramic
Nozzle EOS Aerospike Nozzle
Inert gas Argon
Sieve 63 µm
Additional Information
Layer Thickness 80 µm
Volume Rate 8.0 mm³/s

Chemical and Physical Properties of Parts

Micrograph of polished surface

Microstructure of the Produced Parts

Defects Thickness Result Number of Samples
Average Defect Percentage 80 µm 0.2 % -

Mechanical Properties

Mechanical Properties Heat Treated

EN ISO 6892-1 Room Temperature | 80 µm Yield Strength [MPa] Tensile Strength [MPa] Elongation at Break A [%] Reduction of Area Z [%] Modulus of elasticity [GPa] Number of Samples
Vertical 240 390 53 85 - -
Horizontal 250 410 46 83 - -

Stress relieve: 
Hold temperature 580 °C, hold time minimum 2 h when thoroughly heated. Air cooling or equivalent cooling rate.

Surface Roughness

Coefficient of Thermal Expansion

Temperature
12.6*10-6/K 25 – 100 ºC
13.9*10-6/K 25 – 200 ºC
14.5*10-6/K 25 – 300 ºC
15*10-6/K 25 – 400 ºC
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