Process Data Sheet

EOS Aluminium Constellium CP1 for EOS M 400-4 | 60 µm

EOS M 400-4 - 60 µm - TRL 3

System Setup EOS M 400-4
EOS Material set CP1_060_M404
Software Requirements

EOSPRINT 2.18 or newer

EOSYSTEM 2.22 or newer
Recoater Blade HSS (High Speed Steel)
Build Platform Temperature 150 °C
Nozzle EOS Aerospike Nozzle
Inert gas Argon
Sieve 90 µm
Additional Information
Layer Thickness 60 µm
Volume Rate up to 4 x 10.1 mm³/s

Microstructure of the Produced Parts

Defects Thickness Result Number of Samples
Average Defect Percentage 60 µm 0.4 % -
Density EN ISO 3369 Thickness Result Number of Samples
Average Density 60 µm ≥ 2.73 g/cm³ -

Mechanical Properties

Mechanical Properties Heat Treated

EN ISO 6892-1 Room Temperature | 60 µm Yield Strength [MPa] Tensile Strength [MPa] Elongation at Break A [%] Reduction of Area Z [%] Modulus of elasticity [GPa] Number of Samples
Vertical 300 330 11 - - -
Horizontal 290 325 13 - - -

4 hours at 400 °C
No careful control needed for heating or cooling.

Mechanical Properties As Manufactured

EN ISO 6892-1 Room Temperature | 60 µm Yield Strength [MPa] Tensile Strength [MPa] Elongation at Break A [%] Reduction of Area Z [%] Modulus of elasticity [GPa] Number of Samples
Vertical 130 200 19 - - -
Horizontal 140 200 19 - - -

Hardness

EN ISO 6506 Heat Treated
Value 99
Unit HBW 2.5/62.5
EN ISO 6506 As Manufactured
Value 57
Unit HBW 2.5/62.5

Electrical Conductivity

Orientation Typical Electrical Conductivity [%IACS]
Heat Treated | 60 µm | Vertical 46
Heat Treated | 60 µm | Horizontal 46
Orientation Typical Electrical Conductivity [%IACS]
As Manufactured | 60 µm | Vertical 28
As Manufactured | 60 µm | Horizontal 28

Coefficient of Thermal Expansion

ASTM E228 Temperature
19*10-6/K 25 – 100 ºC
21*10-6/K 25 – 200 ºC
22*10-6/K 25 – 300 ºC
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