Process Data Sheet
EOS Copper Cu for EOS M 290 | 20 µm
EOS M 290 - 20 µm - TRL 3
| System Setup | EOS M 290 |
|---|---|
| EOS Material set | Cu_020_CoreM291_100 |
| Software Requirements |
EOSPRINT 2.6 or higher |
| Recoater Blade | HSS (High Speed Steel) |
| Nozzle | EOS Grid Nozzle |
| Inert gas | Argon |
| Sieve | 63 µm |
| Additional Information | |
|---|---|
| Layer Thickness | 20 µm |
| Volume Rate | 1.7 mm³/s |
Chemical and Physical Properties of Parts
Microstructure of the Produced Parts
| Defects | Thickness | Result | Number of Samples |
|---|---|---|---|
| Average Defect Percentage | 20 µm | < 5 %* % | - |
Mechanical Properties
Mechanical Properties As Manufactured
| EN ISO 6892-1 Room Temperature | 20 µm | Yield Strength [MPa] | Tensile Strength [MPa] | Elongation at Break A [%] | Reduction of Area Z [%] | Modulus of elasticity [GPa] | Number of Samples |
|---|---|---|---|---|---|---|
| Vertical | 180 | 200 | 5 | - | - | - |
| Horizontal | 180 | 200 | 5 | - | - | - |
Mechanical Properties Heat Treated
| EN ISO 6892-1 Room Temperature | 20 µm | Yield Strength [MPa] | Tensile Strength [MPa] | Elongation at Break A [%] | Reduction of Area Z [%] | Modulus of elasticity [GPa] | Number of Samples |
|---|---|---|---|---|---|---|
| Vertical | 140 | 190 | 20 | - | - | - |
| Horizontal | 140 | 190 | 20 | - | - | - |
Copper can be heat treated to reach different mechanical properties and conductivity values.
Properties in the table have been achieved with following heat-treatment:
Hold 1 h at ~ 1,000 °C in argon atmosphere, slow cooling with argon
Electrical Conductivity
| ASTM E1004-17 | Orientation | Typical Electrical Conductivity [%IACS] |
|---|---|---|
| As Manufactured | 20 µm | | Vertical | 80 |
| As Manufactured | 20 µm | | Horizontal | 80 |
| ASTM E1004-17 | Orientation | Typical Electrical Conductivity [%IACS] |
|---|---|---|
| Heat Treated | 20 µm | | Vertical | 90 |
| Heat Treated | 20 µm | | Horizontal | 90 |