EOS Copper CuCP for EOS M 300-4 1kW | 40 µm
EOS M 300-4 1kW - 40 µm - TRL 3
Process Information Metal
The EOS Copper CuCP process contains two exposure sets. The default exposure set with Technology Readiness Level 5 for general use and bulkier parts and an application specific exposure set targeted for inductors.
| System Setup | EOS M 300-4 1kW |
|---|---|
| EOS Material set | CuCP_040_CoreM314 |
| Required Software Plan | EOS BUILD |
| Software Requirements |
EOSPRINT 2.15 or newer EOSYSTEM 2.19 or newer |
| Recoater Blade | HSS (High Speed Steel) |
| Inert gas | Argon |
| Sieve | 63 µm |
| Additional Information | |
|---|---|
| Layer Thickness | 40 µm |
| Volume Rate | Default: 5.4 mm³/s; Inductor: 4.6 mm³/s |
| Min. Wall Thickness | Default: 0.7 mm; Inductor: 0.6 mm |
Chemical and Physical Properties of Parts
Chemical composition of printed parts matches the chemistry of EOS Copper CuCP powder, but can vary due to different oxygen levels in the process, depending on the machine and use level of the powder.
Microstructure of the Produced Parts
| Defects | Thickness | Result | Number of Samples |
|---|---|---|---|
| Average Defect Percentage | 40 µm | 0.25 % | - |
| Average Defect Percentage | 40 µm | 0.4 % | - |
| Density EN ISO 3369 | Thickness | Result | Number of Samples |
|---|---|---|---|
| Average Density | 40 µm | ≥ 8.88 g/cm³ | - |
Mechanical Properties
Mechanical Properties As Manufactured
| EN ISO 6892-1 Room Temperature | 40 µm | Yield Strength [MPa] | Tensile Strength [MPa] | Elongation at Break A [%] | Reduction of Area Z [%] | Modulus of elasticity [GPa] | Number of Samples |
|---|---|---|---|---|---|---|
| Vertical | 165 | 230 | 45 | - | - | - |
| Horizontal | 155 | 230 | 40 | - | - | - |
Modulus of elasticity testing according to EN ISO 6892-1 Method A, Range 1 (0.00007 1/s).
Mechanical Properties As Manufactured
| EN ISO 6892-1 Room Temperature | 40 µm | Yield Strength [MPa] | Tensile Strength [MPa] | Elongation at Break A [%] | Reduction of Area Z [%] | Modulus of elasticity [GPa] | Number of Samples |
|---|---|---|---|---|---|---|
| Vertical | 155 | 220 | 35 | - | - | - |
| Horizontal | 155 | 230 | 45 | - | - | - |
Heat treatment of parts built with EOS Copper CuCP is only optional, but can ensure maximum conductivity and uniform structure.
Hold 1 h at ~1 000 °C, slow cooling. Treatment done in heavy argon flow or in vacuum furnace.
Modulus of elasticity testing according to EN ISO 6892-1 Method A, Range 1 (0.00007 1/s).
Surface Roughness
Electrical Conductivity
| Orientation | Typical Electrical Conductivity [%IACS] | |
|---|---|---|
| As Manufactured | 40 µm | Default | Vertical | 99.6 |
| As Manufactured | 40 µm | Default | Horizontal | 99.6 |
| Orientation | Typical Electrical Conductivity [%IACS] | |
|---|---|---|
| As Manufactured | 40 µm | Application optimised - Inductors | Vertical | 99.7 |
| As Manufactured | 40 µm | Application optimised - Inductors | Horizontal | 99.7 |