Process Data Sheet
EOS Nickel NiCP for EOS M 400-4 | 80 µm
EOS M 400-4 - 80 µm - TRL 3
| System Setup | EOS M 400-4 |
|---|---|
| EOS Material set | NiCP_080_CoreM404_1xx |
| Software Requirements |
EOSPRINT 2.15 or newer EOSYSTEM 2.19 or newer |
| Recoater Blade | Ceramic |
| Nozzle | EOS Aerospike Nozzle |
| Inert gas | Argon |
| Sieve | 63 µm |
| Additional Information | |
|---|---|
| Layer Thickness | 80 µm |
| Volume Rate | 8.0 mm³/s |
Chemical and Physical Properties of Parts
Microstructure of the Produced Parts
| Defects | Thickness | Result | Number of Samples |
|---|---|---|---|
| Average Defect Percentage | 80 µm | 0.2 % | - |
Mechanical Properties
Mechanical Properties Heat Treated
| EN ISO 6892-1 Room Temperature | 80 µm | Yield Strength [MPa] | Tensile Strength [MPa] | Elongation at Break A [%] | Reduction of Area Z [%] | Modulus of elasticity [GPa] | Number of Samples |
|---|---|---|---|---|---|---|
| Vertical | 240 | 390 | 53 | 85 | - | - |
| Horizontal | 250 | 410 | 46 | 83 | - | - |
Stress relieve:
Hold temperature 580 °C, hold time minimum 2 h when thoroughly heated. Air cooling or equivalent cooling rate.
Surface Roughness
Coefficient of Thermal Expansion
| Temperature | |
|---|---|
| 12.6*10-6/K | 25 – 100 ºC |
| 13.9*10-6/K | 25 – 200 ºC |
| 14.5*10-6/K | 25 – 300 ºC |
| 15*10-6/K | 25 – 400 ºC |