| System Setup | EOS M 290 |
|---|---|
| EOS Material set | SuperDuplex_040_080_CoreM291 |
| Powder Product No. | 9030-0035 |
| Software Requirements |
EOSPRINT 2.9 or newer |
| Recoater Blade | Ceramic |
| Nozzle | EOS Grid Nozzle |
| Inert gas | Argon |
| Sieve | 75 µm |
| Additional Information | |
|---|---|
| Layer Thickness | 40 µm, 80 µm, 40/80 µm |
| Volume Rate | 4.1 - 7.9 mm³/s |
Chemical and Physical Properties of Parts
Microstructure of the Produced Parts
| Defects | Thickness | Result | Number of Samples |
|---|---|---|---|
| Average Defect Percentage | 40 µm | 0.06 % | - |
| Average Defect Percentage | 80 µm | 0.1 % | - |
| Density EN ISO 3369 | Thickness | Result | Number of Samples |
|---|---|---|---|
| Average Density | - | ≥ 7.70 g/cm³ | - |
Mechanical Properties
Mechanical Properties Heat Treated
| EN ISO 6892-2 Room Temperature | 40 µm | Yield Strength [MPa] | Tensile Strength [MPa] | Elongation at Break A [%] | Reduction of Area Z [%] | Modulus of elasticity [GPa] | Number of Samples |
|---|---|---|---|---|---|---|
| Vertical | 570 | 850 | 34 | - | - | - |
| Horizontal | 570 | 860 | 33 | - | - | - |
Solution annealing: Hold temperature 1100 °C, hold time 1-2 h when thoroughly heated, water quenching.
Mechanical Properties Heat Treated
| EN ISO 6892-2 Room Temperature | 80 µm | Yield Strength [MPa] | Tensile Strength [MPa] | Elongation at Break A [%] | Reduction of Area Z [%] | Modulus of elasticity [GPa] | Number of Samples |
|---|---|---|---|---|---|---|
| Vertical | 570 | 860 | 34 | - | - | - |
| Horizontal | 560 | 860 | 33 | - | - | - |
Solution annealing: Hold temperature 1100 °C, hold time 1-2 h when thoroughly heated, water quenching.
Impact Toughness
| EN ISO 148-1, Charpy-V Heat Treated | |
|---|---|
| Typical Impact Toughness [J] | 100 |
| Layer Thickness | 40 µm |
| EN ISO 148-1, Charpy-V Heat Treated | |
|---|---|
| Typical Impact Toughness [J] | 100 |
| Layer Thickness | 80 µm |
Surface Roughness
| Surface Roughness | From | To |
|---|---|---|
| Sa (µm) | - | - |
| Ra (µm) | - | - |
Coefficient of Thermal Expansion
| ASTM E228 | Temperature |
|---|---|
| 12.53*10-6/K | 25 – 100 ºC |
| 13.42*10-6/K | 25 – 200 ºC |
| 13.79*10-6/K | 25 – 300 ºC |