Driving Down Cost of Ownership: EOS Nickel NiCP Pure Nickel for Advanced Semiconductor Applications

May 13, 2025 | Reading time: 5 min

Semiconductor equipment engineers and manufacturing specialists face unrelenting pressure to maximize wafer throughput while maintaining nanometer-level precision in chemically aggressive environments. Critical components in these systems require materials that deliver exceptional corrosion resistance without compromising performance or system uptime.

According to industry research published in 2024, corrosion in semiconductor manufacturing environments is responsible for over 50% of microelectronic device failures, representing a substantial impact on production efficiency and reliability.

EOS is partnering with global leading suppliers to address these challenges by offering a material innovation: EOS Nickel NiCP, a commercially pure nickel alloy with a minimum purity of 99.0%. This additive manufacturing (AM) material transforms how semiconductor manufacturers approach component design and production, eliminating traditional limitations of protective plating while enhancing component longevity.

Key Benefits of EOS Nickel NiCP for Semiconductor Applications

• Enhanced corrosion resistance: With its exceptional purity, NiCP delivers outstanding resistance to corrosive environments directly impacting consumable lifetime, making it ideal for semiconductor chamber components and chemical processing equipment.
• Maximizing system uptime: Components built with NiCP can offer extended operational life compared to traditional plated parts. This maximizes equipment availability and increases overall wafer fabrication throughput — directly impacting manufacturers' bottom line.
• Design optimization: AM with NiCP enables the creation of optimized thermal management solutions through complex internal channels and innovative geometries impossible with conventional manufacturing methods. These designs can significantly improve heat dissipation, system speed and accuracy.
• Reduced environmental impact: By eliminating the need for electroplating processes, NiCP offers a cleaner, more sustainable manufacturing approach that reduces hazardous waste generation while maintaining or improving component performance.
• Low stress characteristics: NiCP exhibits very low residual stresses, with parts that can often be used in the as-built state.
• Versatile manufacturing options: The material has been thoroughly tested across EOS' industrial 3D printing systems, including the M 290 and M 400-4. The 80 μm parameters on the M 400-4 enable exceptionally high build rates for production efficiency.

Beyond Semiconductors: Versatility Across Industries

While particularly well-suited for semiconductor applications, EOS Nickel NiCP's exceptional properties make it valuable for numerous other industries. Its excellent corrosion resistance and high purity make it ideal for chemical processing equipment and various applications requiring exposure to caustic environments.

The material's high ductility combined with good corrosion resistance opens possibilities for parts that must withstand both mechanical stress and chemical exposure — a common requirement in advanced industrial settings.

Transforming Manufacturing Through Material Innovation

EOS Nickel NiCP exemplifies how advanced materials combined with AM can solve long standing industrial challenges. By enabling the direct production of pure nickel components with optimized designs, EOS is helping semiconductor manufacturers improve performance, reduce environmental impact, and ultimately enhance productivity.

For industries where material purity, corrosion resistance, and precision are non-negotiable requirements, EOS Nickel NiCP offers a forward-thinking solution that addresses current manufacturing limitations while opening new possibilities for component design and performance.