Metal Manufacturing at its Best:
DMLS 3D Printing
Metal 3D Printing - The DMLS Technology
How Does it Work in Detail?
With DMLS it is possible to create metal 3D printed parts directly from a CAD model. The main requirement to create such a part is a metal powder in a metal 3D printer, where an ultra-fine layer of the metal powder is spread across the building platform.
Then, a powerful laser in the 3D printer melts the powder exactly at the points defined by the CAD model. Layer by layer, the process repeats until the part is completed.
What is Metal Additive Manufacturing?
DMLS technology, follows the principle of - "Direkt Metall Laser Schmelzen" (DMLS, Englisch translation Direct Metal Laser Melting). It is a Laser Powder Bed Fusion, or short LPBF technology, and stands for one of the world's most advanced and reliable technologies in metal additive manufacturing.
This industrial grade 3D printing technology is used for serial manufacturing of 3D printed metal parts for a wide range of industries. The main applications are aerospace, automotive, medical, tool and turbomachinery. EOS is the leading global provider for industrial metal 3D printers, materials, and services and has employed DMLS technology for more than three decades.
Freedom of Design
DMLS is the perfect solution when conventional manufacturing technologies reach their limits. By using metal 3D printer, the design guides the production and not vice versa. That gives you maximum creative freedom and the possibility to create individual designs.
With DMLS technology it is possible to create prototypes in the early development phase, leading to a faster time to market. Metal 3D printer also opens new possibilities for the mass production.
DMLS allows flexible, tailored solutions. 3D CAD data designs can be easily adapted and products are manufactured in very short time frames.
Metal 3D printing allows for highly complex structures which would be difficult or impossible to manufacture by using conventional technologies. As the structures are extremely lightweight and stable, functional optimization and integration without additional assembly steps are possible